DMI-2550 is recommended for use as a catalyzed additive or base resin in adhesives or coatings that are designed for high temperature resistance. It has excellent adhesion to a variety of substrates. When used alone, it can produce films that are tough, flexible and demonstrate good peel strength.
DMI-2555 is a unique low viscosity liquid bismaleimide based formulation. DMI-2555 is an enhanced version of DMI-2550 that incorporates additives to increase adhesion to a variety of surfaces.
Modified Polyimide based Negative type Photoresist
DMI-3006 is `The super low-stress resin’ for buffer layer and other organic layers. It shows much lower tensile modulus and much lower cure temperature than conventional resins. DMI-3006 provides the benefits of a polyimide resin film without warpage. Other benefits of the material include very low moisture absorption, excellent electrical performance and enhanced adhesion to metals, especially copper. DMI-3006 can be used with a general photoresist process.
DMI-7005 is recommended for use as a polyimide (PI) replacement resin in FCCL and CCL applications. The material has excellent green strength in film form prior to curing. The material may be homocured (no catalyst) at higher temperatures to increase the Tg. Generally 1 hour at 200ºC is sufficient to fully cure a completely dry film.
DMI-7006 is recommended for use as a polyimide (PI) replacement resin in FCCL and CCL applications. The material has excellent green strength in film form prior to curing. Sub-200ºC curing is possible with the addition of a peroxide free-radical catalyst or the material may be homocured (no catalyst) at higher temperatures to increase the Tg.