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- 半導體材料
- DMI半導體高分子材料
商品明細
聚酯丙烯酸酯甲酯(Polyester Acrylate Methacrylates)
商品簡述
聚酯丙烯酸酯甲酯(Polyester Acrylate Methacrylates):PEAM
商品詳細介紹Product Introduction
聚酯丙烯酸酯甲酯(Polyester Acrylate Methacrylates):PEAM
PEAM-645
PEAM-645 is recommended for use as a base resin in adhesive applications or coating applications. The material if used alone can exhibit brittleness and the incorporation of a toughener (such as ABS, or hyperbranched polyester) is recommended. The oligomer has good solubility in both aliphatic and aromatic co-monomers.
PEAM-1044
PEAM-1044 is recommended for use as a base resin. It has excellent adhesion with low stress due to its high Tg DCPD units. The oligomer has good solubility in both aliphatic and aromatic resins. Exceptionally low warpage can be achieved with the addition of polybutadiene type resins.
PEAM-1769
PEAM-1769 is recommended for use as a base resin or an additive to reduce stress. It has excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units. The oligomer has good solubility in both aliphatic and aromatic solvents and monomers.
PEM-665
PEM-665 is recommended for use as a base resin in dental applications. PEM-665 also has good solubility in both aliphatic and aromatic co-monomers.
PEM-1066
PEM-1066 is recommended for use as a base resin or an additive to reduce stress. It has excellent adhesion on most substrates. It has superior hydrolytic resistance due to the secondary alcohol ester residues in the backbone. The oligomer has good solubility in both aliphatic and aromatic resins.
詳細TDS與SDS請至https://www.designermoleculesinc.com/products.cfm下載。 商品備註說明Product Remark
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