商品明細

苯酯環氧樹脂硬化劑(Phenyl Ester Epoxy Curatives)

商品簡述

苯酯環氧樹脂硬化劑(Phenyl Ester Epoxy Curatives)： EC-Series

商品詳細介紹Product Introduction

苯酯環氧樹脂硬化劑(Phenyl Ester Epoxy Curatives)： EC-Series

EC-234
EC-234 is recommended for use as a curative in epoxy systems and/or free-radically cured systems. EC-234 can cure both with standard free-radical initiators and epoxy catalysts such as imidizoles, amines, and Lewis acids.

EC-298
EC-298 is recommended for use as an epoxy curative for applications where toughness is required.

EC-312
EC-312 is recommended for use as an epoxy curative to improve toughness, hydrophobicity, and hydrolytic stability. A one-to-one equivalent ratio of EC-312 to a difunctional epoxy will (depending on the catalyst used) cure to a thermoplastic resin. To form a thermoset, a twenty equivalent percent excess, or more, of epoxy is recommended. Standard epoxy catalysts such as amines, imidizoles, and Lewis acids work well to cure the EC-312 with epoxy resins.

EC-326
EC-326 is recommended for use as an epoxy curative to improve toughness, hydrophobicity, and hydrolytic stability.

EC-392
EC-392 is recommended for use in epoxy systems or in combination with acrylates, methacrylates, and maleimides. For an all epoxy system a 20% excess of epoxy is recommended for thermosets. Levels of difunctional epoxies near equivalent ratios can produce tough thermoplastic resins.

EC-861
EC-861 is recommended for use as an epoxy curative for systems requiring a high level of toughness, hydrophobicity, and low modulus. EC-861 curative should be used in conjunction with multifunctional epoxies or in the presence of about a 20% excess of difunctional epoxies if a thermoset is desired.

EC-1074
EC-1074 is recommended for use as an epoxy curative in film and pre-applied adhesive compositions.

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