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- 半導體材料
- DMI半導體高分子材料
商品明細
功能性環矽氧烷(Functional Cyclosiloxanes)
商品簡述
功能性環矽氧烷 (Functional Cyclosiloxanes):CS-Series
商品詳細介紹Product Introduction
功能性環矽氧烷 (Functional Cyclosiloxanes):CS-Series
CS-697
CS-697 is recommended for use as a base resin or diluent for epoxy formulations. Most standard epoxy curatives and catalysts will react with the CS-697.
CS-783
CS-783 is recommended for use as an adhesion promoter to mold compounds and metal substrates. Typical addition levels are 1-5% of the total resin. CS-783 can also be used for standard epoxy curatives, catalysts, B-staged and/or hybrid adhesives.
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